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INTEGRATED CIRCUITS
DATA SHEET
74ALVCH16652 16-bit transceiver/register with dual enable; 3-state
Product specification Supersedes data of 1998 Aug 31 File under Integrated Circuits, IC24 1999 Nov 23
Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
FEATURES * In accordance with JEDEC standard no. 8-1A * CMOS low power consumption * MULTIBYTETM flow-through pin-out architecture * Low inductance, multiple supply and ground pins for minimum noise and ground bounce * Direct interface with TTL levels * All data inputs have bus hold * Output drive capability 50 transmission lines at 85 C * Current drive 24 mA at 3.0 V. DESCRIPTION The 74ALVCH16652 consists of 16 non-inverting bus transceiver circuits with 3-state outputs, D-type flip-flops and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. Data on the `A' or `B', or both buses, will be stored in the internal registers, at the appropriate clock inputs (nCPAB or nCPBA) regardless of the select inputs (nSAB and nSBA) or output enable (nOEAB and nOEBA) control inputs. QUICK REFERENCE DATA Ground = 0; Tamb = 25 C; tr = tf = 2.5 ns. SYMBOL tPHL/tPLH fmax CI CPD PARAMETER propagation delay nAn, nBn to nBn, nAn maximum clock frequency input capacitance power dissipation capacitance per latch notes 1 and 2 outputs enabled outputs disabled Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in Volts; (CL x VCC2 x fo) = sum of outputs. 2. The condition is VI = GND to VCC. CONDITIONS CL = 50 pF; VCC = 3.3 V
74ALVCH16652
Depending on the select inputs nSAB and nSBA data can directly go from input to output (real-time mode) or data can be controlled by the clock (storage mode), when OE inputs permit this operating mode. The output enable inputs nOEAB and nOEBA determine the operation mode of the transceiver. When nOEAB is LOW, no data transmission from nBn to nAn is possible and when nOEBA is HIGH, no data transmission from nBn to nAn is possible. When nSAB and nSBA are in the real-time transfer mode, it is also possible to store data without using the internal D-type flip-flops by simultaneously enabling nOEAB and nOEBA. In this configuration each output reinforces its input. Active bus hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
TYPICAL 2.6 350 4.0 22 4.0 ns
UNIT MHz pF pF pF
1999 Nov 23
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
FUNCTION TABLE See note 1. INPUTS nOEAB L L X H L L L L H H H Notes 1. H = HIGH voltage level; L = LOW voltage level; X = don't care; = LOW-to-HIGH. nOEBA H H H H X L L L H H L nCPAB H or L H or L X X X H or L H or L nCPBA H or L H or L X H or L X X H or L nSAB X X X L X X X X L H H nSBA X X X X X L L H X X H DATA I/O
74ALVCH16652
FUNCTION nA0 to nA7 input input input nB0 to nB7 input isolation store A and B data
unspecified(2) store A, hold B output store A in both registers hold A, store B store B in both registers real-time B data to A bus stored B data to A bus real-time A data to B bus stored A data to B bus stored A data to B bus and stored B data to A bus
unspecified(2) input output input output input output input output output
2. The data output functions may be enabled or disabled by various signals at the nOEAB and nOEBA inputs. Data input functions are always enabled, i.e., data at the bus inputs will be stored on every LOW-to-HIGH transition on the clock inputs.
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
ORDERING INFORMATION PACKAGE OUTSIDE NORTH AMERICA 74ALVCH16652DGG PINNING PIN 1 and 28 2 and 27 3 and 26 5, 6, 8, 9, 10, 12, 13 and 14 4, 11, 18, 25, 32, 39, 46 and 53 7, 22, 35, 50 15, 16, 17, 19, 20, 21, 23 and 24 29 and 56 30 and 55 31 and 54 33, 34, 36, 37, 38, 40, 41 and 42 43, 44, 45, 47, 48, 49, 51 and 52 SYMBOL 1OEAB, 2OEAB 1CPAB, 2CPAB 1SAB, 2SAB 1A0 to 1A7 GND VCC 2A0 to 2A7 2OEBA, 1OEBA 2CPBA, 1CPBA 2SBA, 1SBA 2B0 to 2B7 1B7 to 1B0 NORTH AMERICA ACH16652 DGG TEMPERATURE RANGE -40 to +85 C PINS 56 PACKAGE TSSOP
74ALVCH16652
MATERIAL plastic
CODE SOT364-1
DESCRIPTION output enable A-to-B clock input A-to-B select input A-to-B `1A' data inputs/outputs ground (0 V) positive supply voltage `2A' data inputs/outputs output enable B-to-A clock input B-to-A select input B-to-A `2B' data inputs/outputs `1B' data inputs/outputs
1999 Nov 23
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
74ALVCH16652
handbook, halfpage
1OEAB 1CPAB 1SAB GND 1A0 1A1 VCC 1A2 1A3
1 2 3 4 5 6 7 8 9
56 1OEBA 55 1CPBA 54 1SBA 53 GND 52 1B0 51 1B1 50 VCC 49 1B2 48 1B3 47 1B4 46 GND 45 1B5 44 1B6 43 1B7
MNA318
handbook, halfpage
VCC
data input
to internal circuit
1A4 10 GND 11 1A5 12 1A6 13 1A7 14
16652
2A0 15 2A1 16 2A2 17 GND 18 2A3 19 2A4 20 2A5 21 VCC 22 2A6 23 2A7 24 GND 25 2SAB 26 2CPAB 27 2OEAB 28
MNA315
Fig.2 Bus hold circuit.
42 2B0 41 2B1 40 2B2 39 GND 38 2B3 37 2B4 36 2B5 35 VCC 34 2B6 33 2B7 32 GND 31 2SBA 30 2CPBA 29 2OEBA
Fig.1 Pin configuration.
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
74ALVCH16652
handbook, full pagewidth
56 1 55 54 2 3
EN1[BA] EN2 [AB] C3 G4 C5 G6 1 1 5D 6 6 52
29 28 30 31 27 26
EN7 [BA] EN8 [AB] C9 G10 C11 G12 1 7 11D 12 42
5
4
3D
15
10 9D 10 1 1 8
6 8 9 10 12 13 14
1
41 1 2 51 49 48 47 45 44 43 16 17 19 20 21 23 24
1 12
41 40 38 37 36 34 33
MNA317
Fig.3 IEC logic symbol.
handbook, full pagewidth
5 6 8 9 10 12 13 14
1A0 1A1 1A2 1A3 1A4 1A5 1A6 1A7
1B0 1B1 1B2 1B3 1B4 1B5 1B6 1B7
52 51 49 48 47 45 44 43
15 16 17 19 20 21 23 24
2A0 2A1 2A2 2A3 2A4 2A5 2A6 2A7
2B0 2B1 2B2 2B3 2B4 2B5 2B6 2B7
42 41 40 38 37 36 34 33
56 1 3 54 2 55
1OEBA 1OEAB 1SAB 1SBA 1CPAB 1CPBA
29 28 26 31 27 30
2OEBA 2OEAB 2SAB 2SBA 2CPAB 2CPBA
MNA316
Fig.4 Logic symbol.
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
74ALVCH16652
handbook, full pagewidth
nOEBA nOEAB nSBA nCPBA nSAB nCPAB
VCC
nAn
S Y D1 MUX D2 Q D
FFn CP
VCC S D1 Y MUX D Q D2 nBn
FFn CP 8 IDENTICAL CHANNELS
MNA319
Fig.5 Logic diagram (one section).
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER DC supply voltage for maximum speed performance CL = 30 pF for maximum speed performance CL = 50 pF for low-voltage applications VI VO Tamb tr, tf DC input voltage DC output voltage operating ambient temperature input rise and fall times in free air VCC = 2.3 to 3.0 V VCC = 3.0 to 3.6 V LIMITING VALUES 2.3 3.0 1.2 0 0 -40 0 0 CONDITIONS MIN.
74ALVCH16652
TYP. 2.5 3.3 2.4 - - - - -
MAX. 2.7 3.6 3.6 VCC VCC +85 20 10
UNIT V V V V V C ns/V ns/V
In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO IO ICC, IGND Tstg Ptot Note 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 55 C the value of Ptot derates linearly with 8 mW/K. PARAMETER DC supply voltage DC input diode current DC input voltage DC output diode current DC output voltage DC output source or sink current DC VCC or GND current storage temperature power dissipation VI < 0 note 1 VO > VCC or VO < 0 note 1 VO = 0 to VCC CONDITIONS MIN. -0.5 - -0.5 - -0.5 - - -65 for temperature range: -40 to +125 C; - note 2 MAX. +4.6 -50 +4.6 50 50 100 +150 600 UNIT V mA V mA mA mA C mW
VCC + 0.5 V
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
DC CHARACTERISTICS Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL VIH VIL VOH PARAMETER VI (V) HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VIH or VIL IO = -100 A IO = -6 mA IO = -12 mA IO = -12 mA IO = -12 mA IO = -24 mA VOL LOW-level output voltage VIH or VIL IO = 100 A IO = 6 mA IO = 12 mA IO = 12 mA IO = 24 mA Il IOZ ICC ICC input leakage current 3-state output OFF-state current quiescent supply voltage VCC or GND VIH or VIL VCC or GND VO = VCC or GND IO = 0 IO = 0 OTHER VCC (V) 2.3 to 2.7 1.7 2.7 to 3.6 2.0 2.3 to 2.7 - 2.7 to 3.6 - 2.3 2.3 2.7 3.0 3.0 2.3 2.3 2.7 3.0
74ALVCH16652
Tamb = -40 TO +85 C MIN. TYP.(1) 1.2 1.5 1.2 1.5 MAX. - - 0.7 0.8 - - - - - - 0.20 0.40 0.70 0.40 0.55 5 10 40 750
UNIT V V V
2.3 to 3.6 VCC - 0.2 VCC VCC - 0.3 VCC - 0.08 VCC - 0.6 VCC - 0.26 VCC - 0.5 VCC - 0.14 VCC - 0.6 VCC - 0.09 VCC - 1.0 VCC - 0.28 GND 0.07 0.15 0.14 0.27 0.1 0.1 0.2 150 - - - -
2.3 to 3.6 -
V
2.3 to 3.6 - 2.3 to 3.6 - 2.3 to 3.6 - 2.3 to 3.6 -
A A A A
additional quiescent supply VCC - 0.6 current given per data I/O pin with bus hold bus hold LOW sustaining current bus hold HIGH sustaining current bus hold LOW overdrive current bus hold LOW overdrive current 0.7(2) 0.8(2) 1.7(2) 2.0(2)
IBHL IBHH IBHLO IBHHO Notes
2.3(2) 3.0(2) 2.3(2) 3.0(2) 3.6(2) 3.6(2)
45 75 -45 -75 500 -500
- 150 - -175 - -
- - - - - -
A A A A
1. All typical values are measured at Tamb = 25 C. 2. Valid for data inputs of bus hold parts.
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
AC CHARACTERISTICS FOR VCC = 2.3 TO 2.7 V Ground = 0 V; tr = tf 2.0 ns; CL = 30 pF. TEST CONDITIONS SYMBOL tPHL/tPLH PARAMETER WAVEFORMS propagation delay nAn, nBn to nBn, nAn propagation delay nCPAB, nCPBA to nBn, nAn propagation delay nSAB, nSBA to nBn, nAn tPZH/tPZL tPHZ/tPLZ tPZH/tPZL tPHZ/tPLZ tW tsu th fmax Note 1. All typical values are measured at Tamb = 25 C and VCC = 2.5 V. 3-state output enable time nOEAB to nBn 3-state output disable time nOEAB to nBn 3-state output enable time nOEBA to nAn 3-state output disable time nOEBA to nAn clock pulse width HIGH or LOW nCPAB or nCPBA set-up time nAn, nBn to nCPAB, nCPBA hold time nAn, nBn to nCPAB, nCPBA maximum clock pulse frequency see Figs 6 and 10 see Figs 8 and 10 see Figs 7 and 10 see Figs 9 and 10 see Figs 9 and 10 see Figs 9 and 10 see Figs 9 and 10 see Figs 8 and 10 see Figs 8 and 10 see Figs 8 and 10 see Figs 8 and 10 VCC (V)
74ALVCH16652
Tamb = -40 TO +85 C MIN. TYP.(1) 2.7 3.4 3.4 2.6 2.7 2.8 2.5 1.2 0.2 0.1 300 MAX. 4.8 6.8 5.6 4.5 4.5 4.5 4.5 - - - -
UNIT ns ns ns ns ns ns ns ns ns ns MHz
2.3 to 2.7 1.0 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 1.0 1.0 1.0 1.6 3.3 3.3 2.2 2.2 0.6 150
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
AC CHARACTERISTICS FOR VCC = 2.7 V AND VCC = 3.0 TO 3.6 V Ground = 0 V; tr = tf 2.5 ns; CL = 50 pF. TEST CONDITIONS SYMBOL tPHL/tPLH PARAMETER WAVEFORMS propagation delay nAn, nBn to nBn, nAn propagation delay nCPAB, nCPBA to nBn, nAn propagation delay nSAB, nSBA to nBn, nAn tPZH/tPZL tPHZ/tPLZ tPZH/tPZL tPHZ/tPLZ tW tsu th fmax 3-state output enable time nOEAB to nBn 3-state output disable time nOEAB to nBn 3-state output enable time nOEBA to nAn 3-state output disable time nOEBA to nAn clock pulse width HIGH or LOW nCPAB or nCPBA set-up time nAn, nBn to nCPAB, nCPBA hold time nAn, nBn to nCPAB, nCPBA maximum clock pulse frequency see Figs 6 and 10 see Figs 8 and 10 see Figs 7 and 10 see Figs 9 and 10 see Figs 9 and 10 see Figs 9 and 10 see Figs 9 and 10 see Figs 8 and 10 see Figs 8 and 10 see Figs 8 and 10 see Figs 8 and 10 VCC (V) 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 - 1.0 - 1.4 - 1.3 - 1.0 - 1.4 - 1.0 - 1.1 3.3 3.3 1.7 1.4 0.4 0.7 150 150
74ALVCH16652
Tamb = -40 TO +85 C MIN. TYP.(1) 2.8 2.6(2) 3.1 2.9(2) 3.5 3.1(2) 2.4 2.2(2) 3.4 2.7(2) 3.0 2.2(2) 3.1 2.9(2) 1.0 0.7(2) 0.2 0.3(2) 0.1 0.2(2) 320 320(2) MAX. 4.5 3.9 5.2 4.5 6.4 5.3 4.6 4.0 5.1 4.5 4.6 4.0 5.1 4.5 - - - - - - - -
UNIT ns ns ns ns ns ns ns ns ns ns MHz
Notes 1. All typical values are measured at Tamb = 25 C. 2. Typical values at VCC = 3.3 V.
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
AC WAVEFORMS
74ALVCH16652
V handbook, halfpage I nAn, nBn input GND tPHL VOH nBn, nAn output VOL VM
MNA320
handbook, halfpage VI
VM
nSAB, nSBA input GND tPLH VOH nBn, nAn output VOL tPHL
VM
tPLH
VM
MNA321
Fig.6
The inputs nAn, nBn to outputs nBn, nAn propagation delay times.
Fig.7
The inputs nSAB, nSBA to outputs nBn, nAn propagation delays.
handbook, full pagewidth
VI nAn, nBn input GND th tsu VOH nCPAB, nCPBA output VOL tW 1/fmax VOH nBn, nAn output VOL tPHL tPLH
MNA322
VM
th tsu
VM
Fig.8
The nAn, nBn to nCPAB, nCPBA set-up and hold times, clock nCPAB, nCPBA pulse width, maximum clock pulse frequency and the nCPAB, nCPBA to output nBn, nAn propagation delay times.
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
74ALVCH16652
handbook, full pagewidth
VI nOEAB input GND VI nOEBA input GND tPLZ VCC output LOW-to-OFF OFF-to-LOW VOL tPHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled
MNA323
VM
VM
tPZL
VM VX tPZH VY VM
Fig.9
The OE inputs (nOEAB, nOEBA) to outputs nAn, nBn enable and disable times and the input rise and fall times.
Notes: VCC = 2.3 to 2.7 V VM = 0.5VCC; VX = VOL + 150 mV; VY = VOH - 150 mV; VI = VCC; VOL and VOH are typical output voltage drop that occur with the output load. Notes: VCC = 3.0 to 3.6 V and VCC = 2.7 V VM = 1.5 V; VX = VOL + 300 mV; VY = VOH - 300 mV; VI = 2.7 V; VOL and VOH are typical output voltage drop that occur with the output load.
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
74ALVCH16652
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL 50 pF RL 500 VO
RL 500
2 x VCC open GND
MNA296
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH
S1 open 2 x VCC GND VCC <2.7 V VI VCC
2.7 to 3.6 V 2.7 V
Definitions for test circuit. CL = load capacitance including jig and probe capacitance (See Chapter "AC characteristics"). RL = load resistance. RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.10 Load circuitry for switching times.
APPLICATION INFORMATION
handbook, halfpage
handbook, halfpage
BUS A
BUS B
OEAB L
OEBA L
CPAB X
CPBA X
SAB X
SBA L
MNA325
OEAB H
BUS A
OEBA H
CPAB X
CPBA X
SAB L
BUS B
SBA X
MNA326
Fig.11 Real-time transfer; bus B to bus A.
Fig.12 Real-time transfer; bus A to bus B.
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
74ALVCH16652
handbook, halfpage
handbook, halfpage
BUS A
BUS B
OEAB X L L
OEBA H X H
CPAB X
CPBA X
SAB X X X
SBA X X X
MNA327
OEAB H L H
BUS A
OEBA H L L
BUS B
CPAB H or L X H or L CPBA X H or L H or L SAB H X H SBA X H H
MNA328
Fig.13 Store A, B or A and B in one register.
Fig.14 Transfer A stored data to B bus or B stored data to A bus or both at the same time.
handbook, halfpage handbook, halfpage
BUS A
BUS B
OEAB X L
OEAB H L
CPAB
CPBA
SAB X X
SBA X L
OEAB L
BUS A
OEBA H
BUS B
CPAB H or L CPBA H or L SAB X SBA X
MNA330
MNA329
Fig.15 Store bus A in both registers or store bus B in both registers.
Fig.16 Isolation.
1999 Nov 23
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
PACKAGE OUTLINE TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm
74ALVCH16652
SOT364-1
D
E
A X
c y HE vMA
Z
56
29
Q A2 A1 pin 1 index Lp L (A 3) A
1
e bp wM
28
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions). UNIT mm A max. 1.2 A1 0.15 0.05 A2 1.05 0.85 A3 0.25 bp 0.28 0.17 c 0.2 0.1 D (1) 14.1 13.9 E (2) 6.2 6.0 e 0.5 HE 8.3 7.9 L 1.0 Lp 0.8 0.4 Q 0.50 0.35 v 0.25 w 0.08 y 0.1 Z 0.5 0.1 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT364-1 REFERENCES IEC JEDEC MO-153EE EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-02-03 95-02-10
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
74ALVCH16652
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
Suitability of surface mount IC packages for wave and reflow soldering methods
74ALVCH16652
SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not REFLOW(1)
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Philips Semiconductors
Product specification
16-bit transceiver/register with dual enable; 3-state
NOTES
74ALVCH16652
1999 Nov 23
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245004/02/pp20
Date of release: 1999
Nov 23
Document order number:
9397 750 05256

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